Silicon Wafers Type P/B Prime Grade Sio Oxide Silicon Wafers Slices Substrates

Overview 25PCS/Lot Solar Silicon Wafers 3 Inches Type P/B Prime Grade Sio Wafers Oxide Silicon Wafers Slices Substrates

DESCRIPTION

Basic Info

Model NO.	FW-CRYSTAL
Growth Method	CZ and Fz
Orientation	111 or 100
Resistivity	0.0005 to 150
Surface	Double Side Polished or Single Side Polished
Dopant	N Type and P Type
Particles	<30 at 0.3um
Bow	< 30 Um
Ttv	<15 Um
Transport Package	Box
Specification	costomized
Trademark	FW
Origin	China
Production Capacity	100, 000PCS/Month

Product Description

25PCS/Lot Solar Silicon Wafers 3 Inches Type P/B Prime Grade Sio Wafers Oxide Silicon Wafers Slices Substrates

1. what is silicon wafers and it's application:
A silicon wafer is a material essential for manufacturing semiconductors, which are found in all kinds of electronic devices that enrich our lives.

Silicon wafer is the most common material and widely used for a varity of high-tech industries, including integrated circuits, detector or sensor device, MEMS fabrication, opto-electronic components, and solar cells.

Silicon wafer is a very thin round disk cut from high-purity silicon. A round silicon ingot is sliced to thicknesses of approximately 1mm. The surfaces of the resulting disk are polished carefully, then it is cleaned, resulting in the completed wafer. Silicon wafers are made from high-purity silicon, and are the material of semiconductor devices. These wafers can also be fabricated with a SEMI notch or one or two SEMI flats.
Detailed Photos

Silicon Wafers Type P/B Prime Grade Sio Oxide Silicon Wafers Slices Substrates

Manufacturing a Silicon Wafer
Growing a silicon ingot can take anywhere from one week to one month, depending on many factors, including size, quality and the specification. More than 75% of all single crystal silicon wafers grow via the Czochralski (CZ) method.

Silicon Wafers Type P/B Prime Grade Sio Oxide Silicon Wafers Slices Substrates

Equipment we use

Silicon Wafers Type P/B Prime Grade Sio Oxide Silicon Wafers Slices Substrates

Product Parameters

Grow method	CZ or FZ
Diameter	1 to 8 inch
Finish	As cut, lapped, etched, SSP, DSP
Orientation	(100) (111) (110)
Type	N or P
Resistivity	CZ: From 0.0005 to 150 Ωcm FZ: Up to 10 kΩcm